Call For Papers
Paper Submission: February 07, 2022
Author Notification: March 16, 2022
Final Papers Due: March 27, 2022
The 22nd annual IEEE Wireless and Microwave Technology Conference (WAMICON 2022) will be held in Clearwater Beach, Florida April 27th – 28th 2022. The conference will address up-to-date multidisciplinary research needs of wireless and RF technology. The program includes both oral and poster presentations as well as tutorials and special sessions. Prospective authors are invited to submit original and high-quality work for presentation at WAMICON 2022 and publication in IEEE Xplore.
The central theme of WAMICON 2022 is “Waves Through Air and Space”. Submissions on all aspects of related technologies, including antennas, passive and active circuits in aviation, 5G, automotive, communication theory, and radar & radiometer system concepts, are encouraged. We’ve expanded our scope to include Space, IoE, Machine Learning, hardware security, and artificial intelligence, in the context of high-frequency electronics.
Space & Emerging Applications
CubeSats, SmallSats, FlatSats, Remote Sensors, Internet of Space, ASICS & Digital Back Ends, Optical Communications, Machine Learning, Spaceflight Qualification of Wireless Devices and Systems, Biomedical, Energy Harvesting, Wireless Power Transfer, Additive Manufacturing, Aerospace Applications of RF Circuits and System, Space Vehicle Com.
mm-Wave to THz Technologies
5G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Human Body Scanners, Radar, SatCom, Vehicle-to-Everything (V2x), Home/Office Application, Tactical Networks/Data Links, Packaging, MEMS, Integrated Circuits.
Internet of Everything (IoE)
Automotive Systems, Smart Homes, Smart Cities, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide-Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios, Spectrum Management, Wireless Security.
Power Amplifiers, Other Active Components, and Systems
High-Efficiency & Novel PAs, Linearization and Efficiency Enhancement Techniques, High-Power Devices, Linear/Nonlinear Device Modeling, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip/Package, Radar RF/MMIC Electronics, Active Filters, Reliability/Thermal Considerations.
Passive Components and Antennas
Filters, Transmission Line Components, Advanced Packaging, Antennas and Arrays, Meta-Materials, Frequency Selective Surfaces, Non-Foster Impedance Matching, Rectifiers
Paper Submission Instructions
Authors are asked to submit papers electronically in Portable Document Format (PDF). In order to be considered for publication, submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of TBD. Submissions will be evaluated for originality, the significance of the work, technical soundness, and interest to a wide audience.
We encourage early paper submissions by international authors to accommodate U.S. Visa processing times. The steering committee will provide Visa letters, at the author's request, once the paper is accepted. Please review the following link for updated Visa processing times:
For your submission, you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats found here.
Or directly using the links below:
Final manuscripts must be submitted in PDF format that can be generated using IEEE PDF eXpress.
"IEEE reserves the right to exclude a paper from distribution after the conference (e.g., by not including it in IEEE Xplore) if the paper is not presented at the conference."
Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and IEEE will take action against any author who has engaged in either practice.