Call For Papers
Paper Submission Deadline: February 9, 2024
Final Paper Submission Deadline: February 23, 2024
Author Notification: March 11, 2024
Final Papers Due: March 25, 2024
1. WAMICON will continue accepting papers until Feb 23rd due to the received requests and latest program updates. No further extensions will be provided.
2. Review of submitted papers by Feb 9, especially those received from outside the USA, will start immediately to notify authors about outcomes as quickly as possible. If you would like to update a paper submitted before Feb 9th, please inform the TPC co-chairs before doing so. Please see program highlights for updates about the program
3. This year's WAMICON will have a 1st place prize for the Student Paper Competition.
The prize is a travel grant of $1500 to support the travel costs of the best student paper award winner at MTT-S financially sponsored conferences to the following International Microwave Symposium (IMS). If the student cannot attend IMS (for instance, due to visa issues), the student can attend another financially sponsored MTT-S conference.
Student submissions will be selected by the reviewing committee and will need to be presented in-person by the authors.
2023 Presentation Templates
The 24th annual IEEE Wireless and Microwave Technology Conference (WAMICON 2024) will be held in CLearwater Beach, Florida on April 15th – 16th 2024. The conference will address multidisciplinary research and technology trends in RF, Microwaves, and Wireless Communications. The program includes both oral and poster presentations as well as tutorials and special sessions. We invite prospective authors to submit original and high quality work for presentation at WAMICON 2024 and publication in IEEE Xplore.
WAMICON 2024 will be highlighting “Wireless System and Device Innovations for Intelligent Communications and Adaptive Sensing”. We welcome submissions on all aspects of RF, Microwave, Mm-wave Devices and Systems along with hardware and software technologies enabling intelligent communications and sensing. We’ve expanded our scope to include Space, IoE, Machine Learning, hardware security, and artificial intelligence, in the context of high-frequency electronics.
Power Amplifiers (PAs), Active Components, and Systems
High-Efficiency & Novel PAs, Linearization and Efficiency Enhancement Techniques, High-Power Devices, Linear/Nonlinear Device Modeling, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip/Package, Radar RF/MMIC Electronics, Active Filters, Reliability/Thermal Considerations, Wide Bandgap Semiconductors and Epitaxial Material Impacts.
Passive Components and Antennas
Filters, Transmission Line Components, Advanced Packaging, Antennas and Arrays, Novel BeamSteering Techniques, Metamaterials, Metasurfaces, Frequency Selective Surfaces, Non-Foster Impedance Matching, Rectifiers
mm-Wave to THz Technologies
5G/6G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Human Body Scanners, Radar, SatCom, Vehicle-to-Everything (V2x), Home/Office Application, Tactical Networks/Data Links, mm-wave Packaging, MEMS, and Integrated Circuits.
Space & Emerging Applications
CubeSats, SmallSats, FlatSats, Remote Sensors, Internet of Space, ASICS & Digital Back Ends, Optical Communications, Machine Learning, Spaceflight Qualification of Wireless Devices and Systems, Biomedical, Energy Harvesting, Wireless Power Transfer, Additive Manufacturing, Aerospace Applications of RF Circuits and System, Space Vehicle Com.
Internet of Everything (IoE) & Machine Learning
Automotive Systems, Health and Medical Sensors, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios, Spectrum Management, Wireless Security, AI for RF and Systems, ML applications for RF and Microwave Devices and Systems.
Paper Submission Instructions
Authors are asked to submit papers electronically in .PDF format. In order to be considered for publication by the Technical Program Committee, a submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of February 9, 2024. The conference webpage at www.wamicon.org has complete details of submission requirements. Submissions will be evaluated for originality, significance of the work, technical soundness, and interest to a wide audience.
Final Submission Guidelines will be updated soon.
We encourage early paper submissions by international authors to accommodate U.S. Visa processing times. The steering committee will provide Visa letters, at the author's request, once the paper is accepted. Please review the following link for updated Visa processing times:
For your submission, you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats found here.
Or directly using the links below:
"IEEE reserves the right to exclude a paper from distribution after the conference (e.g., by not including it in IEEE Xplore) if the paper is not presented at the conference."
Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and IEEE will take action against any author who has engaged in either practice.