top of page

Call For Papers

Paper Submission: February 8, 2023

Author Notification: February 22, 2023

Final Papers Due: March 1, 2023

Download the Call for Papers

Paper Submission System Link

The 23rd annual IEEE Wireless and Microwave Technology Conference (WAMICON 2023) will be held in Melbourne, Florida on April 17th – 18th 2023. The conference will address up-to-date multidisciplinary research needs of wireless and RF technology. The program includes both oral and poster presentations as well as tutorials and special sessions. Prospective authors are invited to submit original and high-quality work for presentation at WAMICON 2023 and publication in IEEE Xplore.

The central theme of WAMICON 2023 is “Microwave and RF Innovations connecting Government, University and Business communities.”  Submissions on all aspects of related technologies, including antennas, passive and active circuits in aviation, 5G, automotive, communication theory, and radar & radiometer system concepts, are encouraged.  We’ve expanded our scope to include Space, IoE,  Machine Learning, hardware security, and artificial intelligence, in the context of high-frequency electronics.

Power Amplifiers, Other Active Components, and Systems
High-Efficiency & Novel PAs, Linearization and Efficiency Enhancement Techniques, High-Power Devices, Linear/Nonlinear Device Modeling, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip/Package, Radar RF/MMIC Electronics, Active Filters, Reliability/Thermal Considerations, Wide Bandgap Semiconductors and Epitaxial Material Impacts.


Passive Components and Antennas
Filters, Transmission Line Components, Advanced Packaging, Antennas and Arrays, Meta-Materials, Frequency Selective Surfaces, Non-Foster Impedance Matching, Rectifiers

mm-Wave to THz Technologies
5G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Human Body Scanners, Radar, SatCom, Vehicle-to-Everything (V2x), Home/Office Application, Tactical Networks/Data Links, mm-wave Packaging, MEMS, and Integrated Circuits.


Space & Emerging Applications
CubeSats, SmallSats, FlatSats, Remote Sensors, Internet of Space, ASICS & Digital Back Ends, Optical Communications, Machine Learning, Spaceflight Qualification of Wireless Devices and Systems, Biomedical, Energy Harvesting, Wireless Power Transfer, Additive Manufacturing, Aerospace Applications of RF Circuits and System, Space Vehicle Com.


Internet of Everything (IoE)
Automotive Systems, Health and Medical Sensors, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide-Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios, Spectrum Management, Wireless Security, AI for RF and Systems.


Paper Submission Instructions

Authors are asked to submit papers electronically in Portable Document Format (PDF). In order to be considered for publication, submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of February 8, 2023. Submissions will be evaluated for originality, the significance of the work, technical soundness, and interest to a wide audience.


We encourage early paper submissions by international authors to accommodate U.S. Visa processing times. The steering committee will provide Visa letters, at the author's request, once the paper is accepted. Please review the following link for updated Visa processing times:



Paper Format


For your submission, you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats found here.


Or directly using the links below:


MS Word Template (DOCX)

LaTeX Template (ZIP)


Final manuscripts must be submitted in PDF format and must be generated using IEEE PDF eXpress. The conference ID is 53991X. Authors may also utilize IEEE PDF eXpress for the submission of the initial manuscripts.


IEEE Policies

"IEEE reserves the right to exclude a paper from distribution after the conference (e.g., by not including it in IEEE Xplore) if the paper is not presented at the conference."


Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and IEEE will take action against any author who has engaged in either practice.

bottom of page