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Call For Papers

SUBMISSION DEADLINE HAS BEEN EXTENDED

Final Paper Submission Deadline: February 27, 2023

Author Notification: March 13, 2023

Final Papers Due: March 21, 2023

Download the Call for Papers

Paper Submission System Link

Final Submission Instructions

Final manuscripts must be submitted in PDF format and must be generated using IEEE PDF eXpress. The conference ID is 57636X

The link to the IEEE copyright form is available in the paper submission system and must be completed during the final submission. 

Instructions to use IEEEE PDF eXpress:

First-time users should do the following:

1. Select the New Users - Click Here link.
2. Enter the following:
• 57636X for the Conference ID
• your email address
• a password
3. Continue to enter information as prompted. An online confirmation will be displayed and an email confirmation will be sent
verifying your account setup.

Previous users of PDF eXpress need to follow the above steps, but should enter the same password that was used for previous conferences. Verify that your contact information is valid.

The 23rd annual IEEE Wireless and Microwave Technology Conference (WAMICON 2023) will be held in Melbourne, Florida on April 17th – 18th 2023. The conference will address up-to-date multidisciplinary research needs of wireless and RF technology. The program includes both oral and poster presentations as well as tutorials and special sessions. Prospective authors are invited to submit original and high-quality work for presentation at WAMICON 2023 and publication in IEEE Xplore.

The central theme of WAMICON 2023 is “Microwave and RF Innovations connecting Government, University and Business communities.”  Submissions on all aspects of related technologies, including antennas, passive and active circuits in aviation, 5G, automotive, communication theory, and radar & radiometer system concepts, are encouraged.  We’ve expanded our scope to include Space, IoE,  Machine Learning, hardware security, and artificial intelligence, in the context of high-frequency electronics.

Power Amplifiers, Other Active Components, and Systems
High-Efficiency & Novel PAs, Linearization and Efficiency Enhancement Techniques, High-Power Devices, Linear/Nonlinear Device Modeling, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip/Package, Radar RF/MMIC Electronics, Active Filters, Reliability/Thermal Considerations, Wide Bandgap Semiconductors and Epitaxial Material Impacts.

 

Passive Components and Antennas
Filters, Transmission Line Components, Advanced Packaging, Antennas and Arrays, Meta-Materials, Frequency Selective Surfaces, Non-Foster Impedance Matching, Rectifiers


mm-Wave to THz Technologies
5G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Human Body Scanners, Radar, SatCom, Vehicle-to-Everything (V2x), Home/Office Application, Tactical Networks/Data Links, mm-wave Packaging, MEMS, and Integrated Circuits.

 

Space & Emerging Applications
CubeSats, SmallSats, FlatSats, Remote Sensors, Internet of Space, ASICS & Digital Back Ends, Optical Communications, Machine Learning, Spaceflight Qualification of Wireless Devices and Systems, Biomedical, Energy Harvesting, Wireless Power Transfer, Additive Manufacturing, Aerospace Applications of RF Circuits and System, Space Vehicle Com.

 

Internet of Everything (IoE)
Automotive Systems, Health and Medical Sensors, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide-Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios, Spectrum Management, Wireless Security, AI for RF and Systems.

 

Paper Submission Instructions

Authors are asked to submit papers electronically in Portable Document Format (PDF). In order to be considered for publication, submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of February 27, 2023. Submissions will be evaluated for originality, the significance of the work, technical soundness, and interest to a wide audience.

Final Submission

Final manuscripts must be submitted in PDF format and must be generated using IEEE PDF eXpress. The conference ID is 57636X

The link to the IEEE copyright form is available in the paper submission system and must be completed during the final submission. 

Instructions to use IEEEE PDF eXpress:

First-time users should do the following:

1. Select the New Users - Click Here link.
2. Enter the following:
• 57636X for the Conference ID
• your email address
• a password
3. Continue to enter information as prompted. An online confirmation will be displayed and an email confirmation will be sent
verifying your account setup.

Previous users of PDF eXpress need to follow the above steps, but should enter the same password that was used for previous conferences. Verify that your contact information is valid.

 

We encourage early paper submissions by international authors to accommodate U.S. Visa processing times. The steering committee will provide Visa letters, at the author's request, once the paper is accepted. Please review the following link for updated Visa processing times:

https://travel.state.gov/content/travel/en/us-visas/business.html

 

 

Paper Format

 

For your submission, you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats found here.

 

Or directly using the links below:

 

MS Word Template (DOCX)

LaTeX Template (ZIP)

 

 

IEEE Policies

"IEEE reserves the right to exclude a paper from distribution after the conference (e.g., by not including it in IEEE Xplore) if the paper is not presented at the conference."

 

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and IEEE will take action against any author who has engaged in either practice.

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