Workshop Session
Speaker #1
Dr. Jeff Tharp
​Affiliation:
Product Manager for Thermal Integrity in Electronics, Ansys
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Abstract: Heterogeneous integration is reshaping RF system design as 3DIC, SiP, AiP and advanced packaging introduce dense interconnects, stacked die, and complex power delivery networks that directly impact RF performance. Traditional sign off misses package induced EM coupling, PDN resonances, and thermal drift that collectively degrade sensitivity and desense RF front ends. We present an overview of our simulation methodology spanning layout accurate EM extraction and RF/PI/thermal analysis. The flow leverages Synopsys RaptorX for full wave EM of RDL/interposers/bumps, Ansys HFSS / HFSS IC for high fidelity 3D structures and on die coupling, and Icepak for steady state and transient thermal profiles with electrical feedback. The approach scales to multi die RF SoPs and provides a path to robust, first pass silicon in next gen RF packages.
Speaker #2
Mr. Bryce Hotalen
​Affiliation:
Senior Principal Engineer, Cadence
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Abstract: This workshop introduces a practical, end to end workflow for designing an RF GaN power amplifier MMIC and integrating it into a multi chip front end module with acoustic filters and silicon switch IP on a single laminate substrate. The emphasis is on accelerating MMIC design and chip module co design using a unified, RF aware flow that combines circuit simulation, electromagnetic (EM) analysis, and verification.