Workshop Session
Speaker 1
Dr. Muhannad Bakir
​Affiliation:
Professor, Georgia Tech
Abstract:​
This presentation will first begin with a motivation of 2.5D/3DHI technologies and highlight recent commercial products. Next, we will present an overview of emerging 3DHI technologies for both digital and RF/mm-wave technologies leveraging silicon- and glass-based technologies. We will emphasize the processes, bonding/assembly technologies, and electrical and thermal performances. Special emphasis will be placed on novel bonding processes including inverse hybrid bonding and silicon/glass chiplet reconstitution processes. We will also discuss opportunities for photonic co-integration.
Speaker #2
Dr. Jeff Tharp
​Affiliation:
Product Manager for Thermal Integrity in Electronics, Ansys
​
Abstract: Heterogeneous integration is reshaping RF system design as 3DIC, SiP, AiP and advanced packaging introduce dense interconnects, stacked die, and complex power delivery networks that directly impact RF performance. Traditional sign off misses package induced EM coupling, PDN resonances, and thermal drift that collectively degrade sensitivity and desense RF front ends. We present an overview of our simulation methodology spanning layout accurate EM extraction and RF/PI/thermal analysis. The flow leverages Synopsys RaptorX for full wave EM of RDL/interposers/bumps, Ansys HFSS / HFSS IC for high fidelity 3D structures and on die coupling, and Icepak for steady state and transient thermal profiles with electrical feedback. The approach scales to multi die RF SoPs and provides a path to robust, first pass silicon in next gen RF packages.
Speaker #3
Mr. Bryce Hotalen
​Affiliation:
Senior Principal Engineer, Cadence
​
Abstract: This workshop introduces a practical, end to end workflow for designing an RF GaN power amplifier MMIC and integrating it into a multi chip front end module with acoustic filters and silicon switch IP on a single laminate substrate. The emphasis is on accelerating MMIC design and chip module co design using a unified, RF aware flow that combines circuit simulation, electromagnetic (EM) analysis, and verification.
Speaker #4
Dr. Jan Budroweit
​Affiliation:
Team Leader, Radiation effects in Space subsystems, German Aerospace Center (DLR)
​
Abstract: Software-defined radios (SDRs) are key enablers of flexible and resource-efficient spacecraft architectures. This paper presents a multifunction SDR platform designed to support spaceborne radio frequency (RF) experimentation while autonomously handling payload data generation, storage, and S-band downlink in compliance with relevant ECSS/CCSDS requirements. By consolidating sensing, processing, and communication capabilities within a single unit, the system reduces spacecraft subsystem dependencies, integration complexity, and resource usage. The proposed approach demonstrates how SDR-based payload nodes can increase mission adaptability, enable in-orbit reconfiguration, and support future multi-application RF experiments.
